pb lead-free parts ligitek electronics co.,ltd. property of ligitek only doc. no : qw0905-ldd405/62-xx-pf rev. : a date : 20 - mar. - 2006 data sheet ldd405/62-xx-pf dual digit led display (0.40 lnch)
? 0.5 typ. dig.2 12.6 (0.496") 16.0 (0.630") 1.3(0.051") 4.7 0.5 6.9 (0.272") dig.1 ldd405/62-xx-pf ligitek 10.16 (0.40") pin no.1 20.2 (0.795") 2.45x7= 17.15(0.675") dig.2 page 1/8 part no. ldd405/62-xx-pf package dimensions ligitek electronics co.,ltd. property of ligitek only b c dp a e d f note : 1.all dimension are in millimeters and (lnch) tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice.
ldd4052-xx-pf g f e d c 11 6 7 5 9 b a dig.2 g f e d c 12 10 214 3 1 4 ldd4062-xx-pf 16 8 g e f c d 67119 a b g e f c d 13214161012 8 dig.2 b a 13 15 a b 1513 dig.1 dig.1 45 ligitek electronics co.,ltd. property of ligitek only page 2/8 internal circuit diagram part no. ldd405/62-xx-pf
ldd4062-xx-pf pin no. ldd4052-xx-pf pin no. 1 3 5 4 2 7 6 9 8 10 12 11 14 16 15 13 16 anode f dig.1 anode g dig.1 5 4 6 7 8 9 10 11 12 anode e dig.2 anode c dig.2 anode g dig.2 anode a dig.2 anode f dig.2 anode b dig.2 15 14 anode a dig.1 13 anode b dig.1 anode d dig.2 common cathode dig.2 common cathode dig.1 anode d dig.1 anode e dig.1 3 2 1 anode c dig.1 cathode f dig.2 cathode b dig.2 cathode a dig.2 cathode g dig.2 cathode c dig.2 cathode e dig.2 cathode d dig.2 cathode d dig.1 cathode e dig.1 cathode c dig.1 common anode dig.1 common anode dig.2 cathode f dig.1 cathode a dig.1 cathode g dig.1 cathode b dig.1 ligitek electronics co.,ltd. property of ligitek only page 3/8 electrical connection part no. ldd405/62-xx-pf
4/8 page unit ma ma mw ratings symbol 30 100 120 i f pd i fp g parameter peak forward current per chip (duty 1/10,0.1ms pulse width) power dissipation per chip forward current per chip absolute maximum ratings at ta=25 ligitek electronics co.,ltd. property of ligitek only a min. typ. iv(mcd) iv-m 4.0 2.35 2:1 10 -25 ~ +85 -25 ~ +85 ir t opr tstg operating temperature storage temperature reverse current per any chip max. typ. vf(v) (nm) min. 2.6 2.1 1.7 30 p ( nm) common cathode or anode 565 common cathode common anode chip material part no gap ldd4052-xx-pf ldd4062-xx-pf note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. green emitted solder temperature 1/16 inch below seating plane for 3 seconds at 260 part selection and application information(ratings at 25) electrical part no. ldd405/62-xx-pf
page5/8 unit symbol parameter test condition for each parameter nm mcd nm a p iv ir iv-m luminous intensity per chip peak wavelength spectral line half-width reverse current any chip luminous intensity matching ratio forward voltage per chip vf volt vr=5v if=10ma if=20ma if=20ma test condition if=20ma ligitek electronics co.,ltd. property of ligitek only part no. ldd405/62-xx-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip fig.6 directive radiation 6/8 part no. ldd405/62-xx-pf
page 7/8 ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:solder temperature 1/16 inch below seating plane for 3 seconds at 260 c 2.wave soldering profile dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:solder temperature 1/16 inch below seating plane for 3 seconds at 260 c 260 c3sec max 5 /sec max 260 120 temp( c) time(sec) 150 50 100 2 /sec max 25 0 preheat 0 60 seconds max part no. ldd405/62-xx-pf
8/8 page ligitek electronics co.,ltd. property of ligitek only reference standard description test condition operating life test test item reliability test: mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test low temperature storage test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles high temperature high humidity test solder resistance test thermal shock test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.under room temperature 2.if=10ma 3.t=1000 hrs (-24hrs, +72hrs) mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to see soldering well performed or not. 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 part no. ldd405/62-xx-pf
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